• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    The invention relates to two methods for producing current sensors having a plastic housing produced in IC technology. The central steps are to mount and wire semiconductor chips with Hall sensors on a leadframe, to place the leadframe in an injection mold, to close the injection mold with a first mold insert and to inject plastic material, wherein each semiconductor chip is packaged in an intermediate housing (10), which has a flat surface with Alignierungsstrukturen. Subsequently, the injection mold is opened and placed on the flat surface of each intermediate housing (10) a current conductor portion (15) which is formed with matching to the Alignierungsstrukturen counter-structures (14) so that it is automatically aligned and held. Then, the injection mold is closed with a second mold insert and plastic material injected to form the final housing of the current sensors. Two different injection molds can also be used.
    公开号:CH710644A1
    申请号:CH00079/15
    申请日:2015-01-22
    公开日:2016-07-29
    发明作者:Chen Jian；Racz Robert
    申请人:Melexis Tech Sa；
    IPC主号:
    专利说明:

    The invention relates to a method for the production of current sensors, which comprise a manufactured in IC technology plastic housing with protruding from the housing electrical connections and a protruding from the housing conductor through which flows the current to be measured.
    The invention consists in the features specified in claims 1 and 4. Further developments of the invention will become apparent from the dependent claims.
    The invention will be explained in more detail by means of embodiments and with reference to the drawing. The figures are not drawn to scale.<Tb> FIG. 1 to 5 <SEP> show various snapshots of the manufacturing method according to the invention, and<Tb> FIG. Fig. 6 <SEP> shows in perspective view a current sensor manufactured by this method.
    A first method according to the invention for the production of current sensors comprises the steps explained below and will be explained with reference to FIGS. 1 to 5, which show snapshots in a top view. FIG. 1 shows the state after step B. FIG. 2 shows the state after step C. FIG. 3 shows the state after step F. FIG. 4 shows the state after step G. FIG Fig. 5 shows the state after the step J. Fig. 6 is a perspective view showing a current sensor manufactured by this method.
    The starting point of the method is a leadframe 1, which contains a plurality of the same leadframe sections 2, from each of which a current sensor is formed. Each leadframe section 2 contains a support surface 3 for a semiconductor chip 4 with one or more integrated Hall sensor (s) 5, and electrical connection fingers 6. FIGS. 1, 2, 4 and 5 show only parts of a single leadframe section 2, these parts being hatched and as usual with the not shown frame of the leadframe 1 (or simply connected to the leadframe 1). The method comprises the method steps A to K, which are carried out in the following order:<tb> A) <SEP> mounting a semiconductor chip 4 with an integrated Hall sensor 5 on each of the bearing surfaces 3 of the leadframe 1;<tb> B) <SEP> connecting electrical connection surfaces 7 of the semiconductor chips 4 with associated connection fingers 6 of the leadframe 1 by bonding wires 8;Fig. 1 shows the state after this step, wherein additionally the (not yet available) final housing 16 is shown.<tb> C) <SEP> placing the lead frame 1 in an injection mold 9;2 shows the leadframe 1 placed in the injection mold 9.<tb> D) <SEP> closing the injection mold 9 with a first mold insert having a patterned forming surface;This structured shaping surface faces that side of the leadframe 1 on which the semiconductor chips 4 are mounted.<E> <SEP> Injecting plastic material into the injection mold 9 to package each semiconductor chip 4 and parts of the associated lead frame section 2 in an associated intermediate housing 10, the structures of the molding surface of the first mold insert on each intermediate housing 10 being a flat surface 11 form with alignment structures 12;The Alignierungsstrukturen 12 are, for example, four projecting from the flat surface 11 of the intermediate housing 10 cam 13, as shown in FIG. The flat surface 11 is located above the semiconductor chip 4.<tb> F) <SEP> Opening the injection mold;FIG. 3 shows a single lead frame section 2 after this step. The left and right from the intermediate housing 10 outstanding parts of the lead frame section 2 are still connected to the leadframe 1, but this is not shown for reasons of clarity of the drawing.<tb> G) <SEP> Place each of a conductor section 15 on the flat surfaces 11 of the intermediate housings 10, each conductor section 15 being formed with mating structures 14 matching the aligning structures 12, so that the conductor section 15 is automatically aligned and held;4 shows the lead frame section 2 after this step. In the example shown here, the counter-structures 14 are four recesses into which the cams 13 fit exactly, i. practically without play, intervene.<tb> H) <SEP> closing the injection mold with a second mold insert;injecting plastic material into the injection mold 9 to connect the conductor sections 15 to the associated intermediate housing 10 and to form the final housings 16 of the current sensors 17;<tb> J) <SEP> opening the injection mold 9 and taking out the lead frame 1 from the injection mold 9;FIG. 5 shows the lead frame section 2 after this step. The left and right of the intermediate housing 10 outstanding parts of the lead frame section 2 are - although not shown here - still connected to the leadframe 1, and<tb> K) <SEP> Separating the Current Sensors 17.
    The lead frame sections 2 are therefore connected to and with the step J to the leadframe 1. When separating the current sensors 17 are separated from the no longer required parts of the leadframe 1, usually by one or more punching processes. If desired, subsequently protruding from the housing 16 connecting fingers 6 and also the current conductor sections 15 are bent. Those parts of the leadframe sections 2 which connect the support surfaces 3 for the semiconductor chip 4 to the leadframe 1 are preferably placed so that the punching tool passes without contact when these parts are separated at the current conductor section 15.
    The method is also suitable for integrating passive components 18 (FIG. 1) into the housing 16 of the current sensor 17. The passive components 18 may either be mounted on the leadframe 1 prior to step C or D and be packaged in the intermediate housing 10 in step E, or mounted on the leadframe 1 prior to step H, and packaged in the final housing 16 in step I. ,
    A second method according to the invention comprises steps A to F of the first method according to the invention, wherein said injection mold 9 is a first injection mold, and then further the following steps G to L:<tb> G) <SEP> removing the leadframe 1 from the first injection mold, transporting the leadframe 1 to a second injection mold, and placing the leadframe 1 in the second injection mold;placing a respective conductor section 15 on the flat surfaces 11 of the intermediate housings 10, each conductor section 15 being formed with counter-structures 14 matching the aligning structures 12, so that the conductor section 15 is automatically aligned and held;<tb> I) <SEP> Close the second injection mold;injecting plastic material into the second injection mold to connect the conductor sections 15 to the associated intermediate housing 10 and to form the final housings 16 of the current sensors 17;<tb> K) <SEP> opening the second injection mold and taking out the leadframe 1 from the second injection mold;and<tb> L) <SEP> Separating the Current Sensors 17.
    The second injection mold is closed with a mold insert corresponding to the shape of the final housing. This mold insert is thus equal to the second mold insert in the first method.
    It can also be in the second method before step D passive components mounted on the lead frame and mitpackt in step E in the intermediate housing or mounted before step I passive components on the lead frame and mitverpackt in step J in the final housing become.
    Furthermore, prior to the step of placing a respective conductor portion 15 on the flat surfaces 11 of the intermediate housing 10, an electrical insulator can be placed on the flat surfaces 11 of the intermediate housing 10, wherein the insulators are formed with matching to the Alignierungsstrukturen 12 counter structures and be aligned with the Alignierungsstrukturen 12, or it can be an electrically insulating tape on the conductor section 15 on the semiconductor chip 4 side facing. It may also be the semiconductor chip 4 facing side of the current conductor section 15 coated with electrically insulating material. The electrical insulators or tapes or this layer are made of a different material than the plastic material used for the intermediate housing 10 and for the final housing 16.
    Furthermore, after the step of placing each of a conductor section 15 on the flat surfaces 11 of the intermediate housing 10 on each conductor section 15, a ferromagnetic sheet can be placed. The ferromagnetic sheet serves to reinforce the magnetic field generated by the current flowing through the current conductor section 15. The ferromagnetic sheet and the conductor section 15 are advantageously designed such that the ferromagnetic sheet is fixable on the conductor section 15.
    The current conductor sections 15 can - as shown - be individual parts that are flat or bent into a shape suitable for later use. The current conductor sections 15 can, however, also be part of a further leadframe and are then also separated from one another in step K or L, respectively.
    The plastic material used to make the final housing is advantageously the same as the plastic material used to make the intermediate housing.
    权利要求:
    Claims (9)
    [1]
    1. A method of making current sensors, comprising the steps of:A) mounting a semiconductor chip (4) with an integrated Hall sensor (5) on each of the bearing surfaces (3) of the leadframe (1),B) connecting electrical connection surfaces (7) of the semiconductor chips (4) with associated connection fingers (6) of the leadframe (1) by bonding wires (8),C) placing the leadframe (1) in an injection mold (9),D) closing the injection mold (9) with a first mold insert having a mold surface provided with structures,E) injecting plastic material into the injection mold (9) to package each semiconductor chip (4) and associated parts of the leadframe (1) in an associated intermediate housing (10), the structures of the mold surface of the first mold insert being supported on each intermediate housing (10) form a flat surface (11) with aligning structures (12),F) opening the injection mold (9),G) placing a current conductor section (15) on the planar surfaces (11) of the intermediate housings (10), each current conductor section (15) being formed with mating structures (14) matching the alignment structures (12) so that the current conductor section (15) is automatically terminated is aligned and held,H) closing the injection mold (9) with a second mold insert,I) injecting plastic material into the injection mold (9) to connect the conductor sections (15) to the associated intermediate housing (10) and to form the final housings (16) of the current sensors (17),J) opening the injection mold (9) and removing the leadframe (1) from the injection mold (9), andK) separating the current sensors (17).
    [2]
    2. The method of claim 1, further comprisingbefore step D) mounting passive components (18) on the leadframe (1), andin step E), packaging the passive components (18) in the intermediate housing (10).
    [3]
    3. The method of claim 1, further comprisingbefore step H) mounting passive components (18) on the leadframe (1), andin step I), packaging the passive components (18) into the final housing (16).
    [4]
    4. Method of making current sensors, comprising the following steps:A) mounting a semiconductor chip (4) with an integrated Hall sensor (5) on each of the bearing surfaces (3) of the leadframe (1),B) connecting electrical connection surfaces (7) of the semiconductor chips (4) with associated connection fingers (6) of the leadframe (1) by bonding wires (8),C) placing the leadframe (1) in a first injection mold,D) closing the first injection mold with a first mold insert having a mold surface provided with structures,E) injecting plastic material into the first injection mold to package each semiconductor chip (4) and associated parts of the leadframe (1) in an associated intermediate housing (10), the structures of the mold surface of the first mold insert on each intermediate housing (10) being planar Form surface (11) with aligning structures (12),F) opening the first injection mold,G) removing the leadframe (1) from the first injection mold, transporting the leadframe (1) to a second injection mold and placing the leadframe (1) in the second injection mold;H) placing a respective current conductor section (15) on the flat surfaces (11) of the intermediate housings (10), wherein each current conductor section (15) is formed with counter-structures (14) matching the alignment structures (12), such that the current conductor section (15) 15) is automatically aligned and held;I) closing the second injection mold with a second mold insert;J) injecting plastic material into the second injection mold to connect the conductor sections (15) to the associated intermediate housing (10) and to form the final housings (16) of the current sensors (17);K) opening the second injection mold and removing the leadframe (1) from the second injection mold; andL) separating the current sensors (17).
    [5]
    5. The method of claim 4, further comprisingbefore step D mounting passive components (18) on the leadframe (1), andin the step E, co-packaging the passive components (18) in the intermediate housing (10).
    [6]
    6. The method of claim 4, further comprisingbefore step I mounting passive components (18) on the leadframe (1), andin step J, wrapping the passive components (18) in the final housing (16).
    [7]
    A method according to any one of claims 1 to 6, further comprising prior to the step of placing a respective conductor portion (15) on the planar surfaces (11) of the intermediate housings (10): placing an electrical insulator on each of the planar surfaces (11) Intermediate housing (10), wherein the insulator is formed with matching to the Alignierungsstrukturen (12) counter-structures (14), so that the insulator is automatically aligned and held, or attaching an electrically insulating tape on the current conductor portion (15) on the semiconductor chip ( 4) facing side.
    [8]
    8. The method of claim 1, further comprising, after the step of placing a respective conductor section on the flat surfaces of the intermediate housings, placing a ferromagnetic sheet on each conductor section.
    [9]
    9. The method according to any one of claims 1 to 8, further comprisingUsing a same plastic material for the production of the intermediate housing (10) and the final housing (16).
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    同族专利:
    公开号 | 公开日
    JP2016148652A|2016-08-18|
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    EP3048653A1|2016-07-27|
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    CH710644B1|2018-10-15|
    US9570672B2|2017-02-14|
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    法律状态:
    优先权:
    申请号 | 申请日 | 专利标题
    CH00079/15A|CH710644B1|2015-01-22|2015-01-22|Method for producing current sensors.|CH00079/15A| CH710644B1|2015-01-22|2015-01-22|Method for producing current sensors.|
    EP16150995.5A| EP3048653B1|2015-01-22|2016-01-13|Method of making current sensors|
    JP2016006769A| JP6524491B2|2015-01-22|2016-01-18|Method of manufacturing current sensor|
    US15/003,608| US9570672B2|2015-01-22|2016-01-21|Method of making current sensors|
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